STENCLEAN™ Stencil wiping rolls are used to remove residual solder paste from the bottom side of PC Broad stencils.
Frequent use of STENCLEAN™ wiping rolls prevents smearing, bridging and solder balls caused by residual paste. STENCLEAN™ is specially formulated for critical cleaning application in electronics, clean room and medical.
Product Selection Guide
The STECLEAN™ product selection guide is designed to assist you in determining the roll that will fit your machine and match your cleaning process - Vacuum or Regular.
|
Model |
Non Vacuum |
Vacuum |
Core Length in / mm |
Core I.D. in / mm |
Cut-Back in / mm |
Paper Width in / mm |
|
MPM |
AP and UP Series AP Series AP Series UP Series |
C1 / C6 / C8 PT1 / PT2 |
18.00 / 457 18.00 / 457L 25.25 / 641 24.50 / 622 |
0376 / 19.50 1.00 / 25.40 0.76 / 19.50 0.76 / 19.50 |
0.50 / 12.70 0.50 / 12.70 0.50 / 12.70 0.50 / 12.70 |
17.00 / 431.60 17.00 / 431.60 24.25 / 615.60 23.50 / 596.60 |
||
DEK |
265 Series 265GS Series 265GS Series 265 Series 265 Series |
C1 / C6 / C8 PT1 / PT2 |
F1 / FV45 C100 / JF601 |
21.25 / 540 20.87 / 530 20.87 / 530L 18.00 / 457 14.00 / 356 |
0.76 / 19.50 0.76 / 19.50 0.76 / 19.50 0.76 / 19.50 0.76 / 19.50 |
X 0.25 / 6.35 X X X |
21.25 / 540 20.37 / 517.30 20.87 / 530 18.00 / 457 14.00 / 356 |